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- W2000596344 abstract "A Si wafer was sequentially sputter-coated with Ti (20 nm), Cu (6 µm), Sn (4 µm), and In (4 µm). The specimen was then diffusion-soldered at temperatures between 150 and 300°C with an alumina substrate deposited with Cu (4 µm) and Au (6 µm). Experimental results showed that a multilayer of intermetallic phases with the compositions of (Cu0.99Au0.01)6(Sn0.52In0.48)5/(Au0.87Cu0.13)(In0.94Sn0.06)2/(Au0.98Cu0.02) (In0.95Sn0.05) formed at the Au/Cu interface. Kinetic analyses revealed that the growth of (Cu0.99Au0.01)6 (Sn0.52In0.48)5 and (Au0.87Cu0.13)(In0.94Sn0.06)2/(Au0.98Cu0.02)(In0.95Sn0.05) intermetallics were diffusion-controlled with activation energies of 21.5 and 31.3 kJ/mol, respectively. Sound tensile strengths of 42 and 48 kg/cm2 have been obtained under the bonding conditions of 150°C for 40 min. and 200°C for 30 min., respectively." @default.
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- W2000596344 date "2006-07-01" @default.
- W2000596344 modified "2023-10-16" @default.
- W2000596344 title "Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer" @default.
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- W2000596344 doi "https://doi.org/10.1007/s11664-006-0150-9" @default.
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