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- W2000605187 abstract "Abstract Reactive sputter or ion etching is widely used for the fabrication of devices based on very-large-scale integration. Halon gas produces a high etch selectivity and an anisotropic etching profile. However, it introduces carbon contamination on etching surface. In this paper, new results of recent dry etching studies will be reviewed and ideas for eliminating carbon contamination will be discussed." @default.
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- W2000605187 date "1982-06-01" @default.
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- W2000605187 title "Recent trends in dry etching" @default.
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- W2000605187 doi "https://doi.org/10.1016/0040-6090(82)90185-7" @default.
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