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- W2000643790 abstract "Hybrid integration techniques (HITs) of planar and non-planar structures are discussed for low-cost and high-performance millimeter-wave integrated circuits (ICs) and systems. Current status of this research topic is reviewed with emphasis on various integration/interconnect schemes of planar circuits and non-radiative dielectric (NRD) guides. Co-layered and aperture-coupling arrangements of planar circuits and NRD-guide are presented. Future trend is forecasted with emphasis on single substrate integration of planar and non-planar geometries. Substrate integrated circuits (SICs) are highlighted that can render the non-planar structures in planar form." @default.
- W2000643790 created "2016-06-24" @default.
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- W2000643790 date "2002-11-13" @default.
- W2000643790 modified "2023-10-18" @default.
- W2000643790 title "Integration and interconnect techniques of planar and non-planar structures for microwave and millimeter-wave circuits - current status and future trend" @default.
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- W2000643790 doi "https://doi.org/10.1109/apmc.2001.985398" @default.
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