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- W2000738034 abstract "The electrical resistivity of the liquid Sb–10 wt-%Cu alloy as a function of temperature was measured using direct current four probe technique. In a relatively high temperature zone above the liquidus, the resistivity–temperature (ρ – T ) curves of the melt change abnormally; moreover, the changing pattern in the first heating process is completely different from the ones in the subsequent heating and cooling cycles. Since resistivity is a structural sensitive parameter, these abnormal changes of ρ – T curves indicate that the temperature-induced liquid–liquid structure transitions (L-LSTs) probably occur in Sb–10 wt-%Cu melt, with some reversible characters. To explore the effects of the L-LST on the solidification behaviours and solidified microstructures of this alloy, solidification experiments were further carried out according to the temperature ranges with anomalous changes on ρ – T curves. Results show that after the melt experienced the L-LST, larger undercooling, shorter solidified time and much finer microstructures with differently microscopic patterns could be obtained." @default.
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- W2000738034 date "2010-11-01" @default.
- W2000738034 modified "2023-09-26" @default.
- W2000738034 title "Effects of liquid–liquid transition on solidification of Sb–10 wt-%Cu alloy" @default.
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- W2000738034 doi "https://doi.org/10.1179/174328409x410917" @default.
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