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- W2000802414 abstract "New data from special bipolar junctions that breakdown below the Si-SiO 2 interface are described. The devices were broken down both in a dc and pulse fashion, and junction degradation in the form of increased reverse leakage and reduced minority carrier lifetime was investigated. No degradation was observed." @default.
- W2000802414 created "2016-06-24" @default.
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- W2000802414 date "1973-03-01" @default.
- W2000802414 modified "2023-09-23" @default.
- W2000802414 title "Subsurface breakdown device reliability" @default.
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- W2000802414 doi "https://doi.org/10.1109/t-ed.1973.17648" @default.
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