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- W2000811913 abstract "A molecular-dynamics simulation of the mechanical properties of nanoscale copper with vacancies under static and cyclic loading has been carried out. From the tensile test, the stress–strain curve for nanoscale copper was obtained first and then the Young’s modulus of the material was determined. The Young’s modulus decreases with increasing vacancy fraction, and it also decreases with increasing temperature. It can be clearly seen that the ultimate tensile stress and elongation rate are high for nanoscale copper, and result in the high fracture energy required to break the nanoscale copper. From the fatigue test, the amplitude stress–number of cycles curve was obtained. Under the lower applied stress, the amplitude stress of the nanoscale copper increases with decreasing vacancy fraction, however, it decreases with decreasing temperature. Furthermore, the fatigue limit of the nanoscale copper increases with decreasing vacancy fraction and increasing temperature, when the material is under a less-than-critical value of applied stress." @default.
- W2000811913 created "2016-06-24" @default.
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- W2000811913 date "2003-01-01" @default.
- W2000811913 modified "2023-10-17" @default.
- W2000811913 title "Molecular-dynamics study of mechanical properties of nanoscale copper with vacancies under static and cyclic loading" @default.
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- W2000811913 doi "https://doi.org/10.1016/s0167-9317(02)00887-0" @default.
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