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- W2000828618 abstract "The selectivity of electroless Ni plating onto submicrometer-scaled Cu patterns less than in width was examined at using a plating solution containing Ti(III) ions as a reducing agent. The composition of the solution was , , citric acid (sodium salt, ), and nitrilotriacetic acid (sodium salt, ). A continuous and uniform Ni layer of about in thickness was found to be epitaxially deposited only on the patterned Cu area, suggesting that the plating method is applicable to a metallizing process for ultrafine devices. The reactions that occurred in the plating solution were discussed from a thermodynamic standpoint. The plating rate was strongly influenced by the immersion potential and pH of the solution. The reduction of water proceeded in the bulk of the plating solution, and this reaction was partially responsible for the lowering of pH and the depression of the plating. Using the stability constants for the -citrate and -nitrilotriacetate systems, we calculated the distribution of Ni(II) complexes in the solution with various concentrations of : the analytical composition was at . The concentration of affected the stability of the plating solution and the plating rate, since the abundances of Ni(II) complexes, i.e., , , and , depended on the concentration of ; the presence of , which is more stable than the others, depressed the nickel plating significantly." @default.
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- W2000828618 date "2005-01-01" @default.
- W2000828618 modified "2023-09-26" @default.
- W2000828618 title "Electroless Nickel Plating onto Minute Patterns of Copper Using Ti(IV)∕Ti(III) Redox Couple" @default.
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- W2000828618 doi "https://doi.org/10.1149/1.1973244" @default.
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