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- W2000845038 abstract "To a great extent, the glass transition temperature (Tg) of a photoresist affects its lithographic processing. In the current work, a non-invasive method based on optical interferometry has been developed and applied for the monitoring of Tgfilm for thin polymeric films in the lithographically useful thickness range. The measurement of Tgfilm is based on the change of film thickness and/or refractive index of the polymeric film during the glass transition, which is reflected as a curvature in the interferograms (interferometric signal vs. temperature). The method has been applied successfully in the case of two methacrylate-based polymers. For these materials the Tgfilm coincides with Tg for the polymer for a thickness range from thick films down to ∼200–250 nm. For thinner layers, the Tgfilm increases as resist thickness decreases." @default.
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- W2000845038 date "2002-07-01" @default.
- W2000845038 modified "2023-10-17" @default.
- W2000845038 title "Non-destructive method for monitoring glass transitions in thin photoresist films" @default.
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- W2000845038 doi "https://doi.org/10.1016/s0167-9317(02)00503-8" @default.
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