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- W2000943353 abstract "As the lead pitch gets finer, numerous problems emerge during manufacturing process of LCD packages. Lead breakage failure at ultra fine pitch (around 30 μm and under) chip/film assembly stage would be one of them. In this paper a failure analysis process on this issue is presented. In order to figure out more detailed phenomena that occurred at miscellaneous area for a very short instant, a numerical approach is utilized along with tests and measurements. A verified/predictive finite element model is developed and applied on flip chip-on-flex and tape carrier packages for LCD applications. The root causes of the lead breakage and dominant effecting factors are identified through various tests and simulations. Design/process guidelines for the packages are proposed to mitigate or remove the risk of the failure." @default.
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- W2000943353 date "2006-02-01" @default.
- W2000943353 modified "2023-10-14" @default.
- W2000943353 title "A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process" @default.
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- W2000943353 doi "https://doi.org/10.1016/j.microrel.2005.06.013" @default.
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