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• W2001684282 endingPage "4763" @default.
• W2001684282 startingPage "4760" @default.
• W2001684282 abstract "Using a flattened SiO2/Cu electrode/36–48° LiTaO3 structure, a small (5×5 mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US personal communication services (PCS) was realized by the authors. However, a smaller duplexer is strongly required. Using the flip-chip bonding process of SAW chips and a Rayleigh SAW propagating on a flattened SiO2/Cu electrode/126–128° YX-LiNbO3 structure, which has a larger coupling factor than the above-mentioned substrate, a smaller (3×2.5 mm2) SAW duplexer with a good TCF was realized." @default.
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• W2001684282 date "2007-07-26" @default.
• W2001684282 modified "2023-10-04" @default.
• W2001684282 title "Smaller Surface Acoustic Wave Duplexer for US Personal Communication Service Having Good Temperature Characteristics" @default.
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• W2001684282 doi "https://doi.org/10.1143/jjap.46.4760" @default.
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