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- W2001781182 abstract "The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu- x Al lead-free solder was systematically investigated. The Sn-0.7Cu- x Al solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%." @default.
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- W2001781182 date "2015-04-01" @default.
- W2001781182 modified "2023-09-26" @default.
- W2001781182 title "Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-<i>x</i>Al Lead-Free Solder Alloy" @default.
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- W2001781182 doi "https://doi.org/10.4028/www.scientific.net/amm.754-755.166" @default.
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