FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2001870828> ?p ?o ?g. }

• W2001870828 endingPage "569" @default.
• W2001870828 startingPage "553" @default.
• W2001870828 abstract "Three-dimensional (3D) silicon integration of active devices with through-silicon vias (TSVs), thinned silicon, and silicon-to-silicon fine-pitch interconnections offers many product benefits. Advantages of these emerging 3D silicon integration technologies can include the following: power efficiency, performance enhancements, significant product miniaturization, cost reduction, and modular design for improved time to market. IBM research activities are aimed at providing design rules, structures, and processes that make 3D technology manufacturable for chips used in actual products on the basis of data from test-vehicle (i.e., prototype) design, fabrication, and characterization demonstrations. Three-dimensional integration can be applied to a wide range of interconnection densities (<10/cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> to 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>8</sup> /cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> ), requiring new architectures for product optimization and multiple options for fabrication. Demonstration test structures, which are designed, fabricated, and characterized, are used to generate experimental data, establish models and design guidelines, and help define processes for future product consideration. This paper 1) reviews technology integration from a historical perspective, 2) describes industry-wide progress in 3D technology with examples of TSV and silicon-silicon interconnection advancement over the last 10 years, 3) highlights 3D technology from IBM, including demonstration test vehicles used to develop ground rules, collect data, and evaluate reliability, and 4) provides examples of 3D emerging industry product applications that could create marketable systems." @default.
• W2001870828 created "2016-06-24" @default.
• W2001870828 creator A5004303128 @default.
• W2001870828 creator A5010084270 @default.
• W2001870828 creator A5012226047 @default.
• W2001870828 creator A5019304892 @default.
• W2001870828 creator A5022667147 @default.
• W2001870828 creator A5051939303 @default.
• W2001870828 creator A5058389051 @default.
• W2001870828 creator A5068016358 @default.
• W2001870828 creator A5072522546 @default.
• W2001870828 creator A5076774031 @default.
• W2001870828 creator A5077920014 @default.
• W2001870828 creator A5078485095 @default.
• W2001870828 creator A5079163836 @default.
• W2001870828 creator A5082051836 @default.
• W2001870828 creator A5086887842 @default.
• W2001870828 creator A5089055387 @default.
• W2001870828 date "2008-11-01" @default.
• W2001870828 modified "2023-10-06" @default.
• W2001870828 title "Three-dimensional silicon integration" @default.
• W2001870828 cites W1497296005 @default.
• W2001870828 cites W1605711829 @default.
• W2001870828 cites W1726454803 @default.
• W2001870828 cites W1947687523 @default.
• W2001870828 cites W1966935150 @default.
• W2001870828 cites W1971990181 @default.
• W2001870828 cites W1972661221 @default.
• W2001870828 cites W1998798907 @default.
• W2001870828 cites W2000917443 @default.
• W2001870828 cites W2005526642 @default.
• W2001870828 cites W2011745227 @default.
• W2001870828 cites W2022127004 @default.
• W2001870828 cites W2027240837 @default.
• W2001870828 cites W2028641195 @default.
• W2001870828 cites W2037771006 @default.
• W2001870828 cites W2037943767 @default.
• W2001870828 cites W2049605506 @default.
• W2001870828 cites W2049928989 @default.
• W2001870828 cites W2051909620 @default.
• W2001870828 cites W2062624166 @default.
• W2001870828 cites W2071003187 @default.
• W2001870828 cites W2084465580 @default.
• W2001870828 cites W2085280616 @default.
• W2001870828 cites W2085343787 @default.
• W2001870828 cites W2093296199 @default.
• W2001870828 cites W2098297070 @default.
• W2001870828 cites W2100357216 @default.
• W2001870828 cites W2104386725 @default.
• W2001870828 cites W2105186625 @default.
• W2001870828 cites W2108632735 @default.
• W2001870828 cites W2113170152 @default.
• W2001870828 cites W2125128523 @default.
• W2001870828 cites W2125356053 @default.
• W2001870828 cites W2128259088 @default.
• W2001870828 cites W2131722625 @default.
• W2001870828 cites W2141504104 @default.
• W2001870828 cites W2147848559 @default.
• W2001870828 cites W2150718209 @default.
• W2001870828 cites W2154060804 @default.
• W2001870828 cites W2154329936 @default.
• W2001870828 cites W2154949292 @default.
• W2001870828 cites W2155461249 @default.
• W2001870828 cites W3147289055 @default.
• W2001870828 cites W3203992401 @default.
• W2001870828 cites W418442035 @default.
• W2001870828 doi "https://doi.org/10.1147/jrd.2008.5388564" @default.
• W2001870828 hasPublicationYear "2008" @default.
• W2001870828 type Work @default.
• W2001870828 sameAs 2001870828 @default.
• W2001870828 citedByCount "433" @default.
• W2001870828 countsByYear W20018708282012 @default.
• W2001870828 countsByYear W20018708282013 @default.
• W2001870828 countsByYear W20018708282014 @default.
• W2001870828 countsByYear W20018708282015 @default.
• W2001870828 countsByYear W20018708282016 @default.
• W2001870828 countsByYear W20018708282017 @default.
• W2001870828 countsByYear W20018708282018 @default.
• W2001870828 countsByYear W20018708282019 @default.
• W2001870828 countsByYear W20018708282020 @default.
• W2001870828 countsByYear W20018708282021 @default.
• W2001870828 countsByYear W20018708282022 @default.
• W2001870828 countsByYear W20018708282023 @default.
• W2001870828 crossrefType "journal-article" @default.
• W2001870828 hasAuthorship W2001870828A5004303128 @default.
• W2001870828 hasAuthorship W2001870828A5010084270 @default.
• W2001870828 hasAuthorship W2001870828A5012226047 @default.
• W2001870828 hasAuthorship W2001870828A5019304892 @default.
• W2001870828 hasAuthorship W2001870828A5022667147 @default.
• W2001870828 hasAuthorship W2001870828A5051939303 @default.
• W2001870828 hasAuthorship W2001870828A5058389051 @default.
• W2001870828 hasAuthorship W2001870828A5068016358 @default.
• W2001870828 hasAuthorship W2001870828A5072522546 @default.
• W2001870828 hasAuthorship W2001870828A5076774031 @default.
• W2001870828 hasAuthorship W2001870828A5077920014 @default.
• W2001870828 hasAuthorship W2001870828A5078485095 @default.
• W2001870828 hasAuthorship W2001870828A5079163836 @default.
• W2001870828 hasAuthorship W2001870828A5082051836 @default.

• next