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• W2002012149 abstract "In this article we study the effect of metallic barriers in inhibiting copper ion drift/diffusion into low-k dielectrics through a mathematical analysis. We extend our previous drift/diffusion model for copper ion drift without barriers to include the effect of metallic barriers. The addition of the barrier changes the boundary condition at the barrier/dielectric interface and results in a time dependent flux and concentration at the interface. The results show that for a given dielectric, a metallic barrier needs to have both a lower ionic solubility and lower ionic diffusivity for optimal effectiveness." @default.
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• W2002012149 date "2009-08-01" @default.
• W2002012149 modified "2023-10-18" @default.
• W2002012149 title "The effect of metallic barriers in inhibiting copper ion transport in low-k dielectrics: Implications for time-to-failure" @default.
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• W2002012149 doi "https://doi.org/10.1016/j.tsf.2009.02.029" @default.
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