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• W2002109264 abstract "The high target power density (up to ∼1000 W cm−2) of a magnetron sputtering process was studied by means of optical emission spectroscopy and Langmuir probe characteristics. The goal of this research was to estimate the composition (neutrals and ions) and parameters of the plasma (temperature Te and density ne of electrons) at different technological parameters. Copper targets with a diameter of 50 and 100 mm were sputtered. The argon pressure was changed from 0 (final pressure equal to 1×10−5 torr) to 5×10−3 torr. This corresponded to self-sustained (at the final vacuum pressure) and standard argon sputtering modes, respectively. The dominant role of copper ions was observed (404.3+ nm ion line intensity in relation to 402.3* and 406.3* excited neutrals line intensities) during both the self-sustained and argon modes of high target power density. The line intensity of copper ions near the etched target surface (cathode voltage fall) increased substantially when the target current increased. The substrate current density (at a distance between target and substrate equal to 9 cm) increased significantly with the decrease of the parallel component of the magnetic field intensity (at constant target current). At this distance, a sputtering rate of ∼5 μm min−1 was achieved for the Cu target of 50 mm in diameter." @default.
• W2002109264 created "2016-06-24" @default.
• W2002109264 creator A5077051000 @default.
• W2002109264 date "2001-07-01" @default.
• W2002109264 modified "2023-09-26" @default.
• W2002109264 title "Plasma parameters of very high target power density magnetron sputtering" @default.
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• W2002109264 doi "https://doi.org/10.1016/s0040-6090(01)01028-8" @default.
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