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- W2002110959 abstract "The understanding of focus variation across a wafer is crucial to CD control (both ACLV and AWLV) and pattern fidelity on the wafer and chip levels. This is particularly true for the 65nm node and beyond, where focus margin is shrinking with the design rules, and is turning out to be one of the key process variables that directly impact the device yield. A technique based on the Phase-Shift Focus Monitor (PSFM) is developed to measure realistic across-wafer focus errors on materials processed in actual production flows. With this technique, we are able to extract detailed across-wafer focus performance at critical pattern levels from the front end of line (FEOL) all the way through the back end of line (BEOL). Typically, more than 8,000 data points are measured across a wafer, and the data are decomposed into an intra-field focus map, which captures the across chip focus variation (ACFV), and an inter-field focus map, which describes the across wafer focus variation (AWFV). ACFV and AWFV are then analyzed to understand various components in the overall focus error, including; across slit lens image field, reticle shape and dynamic scan components, local wafer flatness, wafer processing effect, pattern density, and edge die abnormality. The intra-field ACFV lens component is compared with TI's ScatterLith and ASML's FOCAL techniques. Results are consistent with the predictions based on the on-board lens aberration data. Inter-field AWFV is the most interesting, due to lack of detailed understanding of the process impact on scanner focus and leveling. PSFM data is used to characterize the effect of wafer processing such as etch, deposition, and CMP on across wafer focus control. Comparison and correlation of PSFM focus mapping with the wafer height and residual moving average (MA) maps generated by the scanner's optical leveling sensors shows a good match in general. Process induced focus errors are clearly observed on wafers of significant film stack variation and/or pattern density variation. Implications on total focus control and depth of focus (DOF) requirements for 65nm mass production are discussed in this paper using a quantitative pattern yield model. The same technique can be extended to immersion lithography." @default.
- W2002110959 created "2016-06-24" @default.
- W2002110959 creator A5015059768 @default.
- W2002110959 creator A5023065688 @default.
- W2002110959 creator A5029744002 @default.
- W2002110959 creator A5034858136 @default.
- W2002110959 creator A5035118577 @default.
- W2002110959 creator A5050546639 @default.
- W2002110959 creator A5052547218 @default.
- W2002110959 creator A5066710368 @default.
- W2002110959 creator A5067849098 @default.
- W2002110959 creator A5067884507 @default.
- W2002110959 creator A5068860617 @default.
- W2002110959 date "2006-03-10" @default.
- W2002110959 modified "2023-09-23" @default.
- W2002110959 title "Across wafer focus mapping and its applications in advanced technology nodes" @default.
- W2002110959 doi "https://doi.org/10.1117/12.657752" @default.
- W2002110959 hasPublicationYear "2006" @default.
- W2002110959 type Work @default.
- W2002110959 sameAs 2002110959 @default.
- W2002110959 citedByCount "1" @default.
- W2002110959 crossrefType "proceedings-article" @default.
- W2002110959 hasAuthorship W2002110959A5015059768 @default.
- W2002110959 hasAuthorship W2002110959A5023065688 @default.
- W2002110959 hasAuthorship W2002110959A5029744002 @default.
- W2002110959 hasAuthorship W2002110959A5034858136 @default.
- W2002110959 hasAuthorship W2002110959A5035118577 @default.
- W2002110959 hasAuthorship W2002110959A5050546639 @default.
- W2002110959 hasAuthorship W2002110959A5052547218 @default.
- W2002110959 hasAuthorship W2002110959A5066710368 @default.
- W2002110959 hasAuthorship W2002110959A5067849098 @default.
- W2002110959 hasAuthorship W2002110959A5067884507 @default.
- W2002110959 hasAuthorship W2002110959A5068860617 @default.
- W2002110959 hasConcept C120665830 @default.
- W2002110959 hasConcept C121332964 @default.
- W2002110959 hasConcept C127413603 @default.
- W2002110959 hasConcept C146617872 @default.
- W2002110959 hasConcept C151730666 @default.
- W2002110959 hasConcept C15336307 @default.
- W2002110959 hasConcept C160671074 @default.
- W2002110959 hasConcept C192209626 @default.
- W2002110959 hasConcept C192562407 @default.
- W2002110959 hasConcept C207789793 @default.
- W2002110959 hasConcept C24326235 @default.
- W2002110959 hasConcept C26405456 @default.
- W2002110959 hasConcept C2778530986 @default.
- W2002110959 hasConcept C41008148 @default.
- W2002110959 hasConcept C49040817 @default.
- W2002110959 hasConcept C58097730 @default.
- W2002110959 hasConcept C62520636 @default.
- W2002110959 hasConcept C77928131 @default.
- W2002110959 hasConcept C86803240 @default.
- W2002110959 hasConcept C89002693 @default.
- W2002110959 hasConceptScore W2002110959C120665830 @default.
- W2002110959 hasConceptScore W2002110959C121332964 @default.
- W2002110959 hasConceptScore W2002110959C127413603 @default.
- W2002110959 hasConceptScore W2002110959C146617872 @default.
- W2002110959 hasConceptScore W2002110959C151730666 @default.
- W2002110959 hasConceptScore W2002110959C15336307 @default.
- W2002110959 hasConceptScore W2002110959C160671074 @default.
- W2002110959 hasConceptScore W2002110959C192209626 @default.
- W2002110959 hasConceptScore W2002110959C192562407 @default.
- W2002110959 hasConceptScore W2002110959C207789793 @default.
- W2002110959 hasConceptScore W2002110959C24326235 @default.
- W2002110959 hasConceptScore W2002110959C26405456 @default.
- W2002110959 hasConceptScore W2002110959C2778530986 @default.
- W2002110959 hasConceptScore W2002110959C41008148 @default.
- W2002110959 hasConceptScore W2002110959C49040817 @default.
- W2002110959 hasConceptScore W2002110959C58097730 @default.
- W2002110959 hasConceptScore W2002110959C62520636 @default.
- W2002110959 hasConceptScore W2002110959C77928131 @default.
- W2002110959 hasConceptScore W2002110959C86803240 @default.
- W2002110959 hasConceptScore W2002110959C89002693 @default.
- W2002110959 hasLocation W20021109591 @default.
- W2002110959 hasOpenAccess W2002110959 @default.
- W2002110959 hasPrimaryLocation W20021109591 @default.
- W2002110959 hasRelatedWork W1972898772 @default.
- W2002110959 hasRelatedWork W1980956905 @default.
- W2002110959 hasRelatedWork W2026527331 @default.
- W2002110959 hasRelatedWork W2041013899 @default.
- W2002110959 hasRelatedWork W2061999328 @default.
- W2002110959 hasRelatedWork W2085460812 @default.
- W2002110959 hasRelatedWork W2214749101 @default.
- W2002110959 hasRelatedWork W2911972324 @default.
- W2002110959 hasRelatedWork W2944438779 @default.
- W2002110959 hasRelatedWork W2085531909 @default.
- W2002110959 isParatext "false" @default.
- W2002110959 isRetracted "false" @default.
- W2002110959 magId "2002110959" @default.
- W2002110959 workType "article" @default.