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- W2002131468 abstract "The effect of process conditions on the performance of the chemically amplified radiation resists AZ PF514 (positive tone) and AZ PN114 (negative tone) has been examined for both X-ray and E-beam application. For the positive tone resist, it is found that mandatory atmospheric holding times for the catalytic reaction can be made redundant be the introduction of a post exposure bake at moderate temperature, yielding high exposure latitude, good linearity and a reduction of time-dependent effects. In particular, metal-ion free developers yield highly vertical resist sidewalls even for high overdoses. The sensitivity drift with increasing residence time in a vacuum (e.g. during E-beam exposure) may be counteracted by a simple DUV flood exposure which moreover may serve to control line shape and wall angle. Enhanced dry-etch stability and linearity may be obtained by means of an optimized DUV hardening process. The negative tone resist AZ PN114 is shown to be little sensitive to vacuum effects; thermal stability and dry etching properties are found to be superior. Results are presented for X-ray and shaped E-beam exposures." @default.
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- W2002131468 date "1991-06-01" @default.
- W2002131468 modified "2023-09-23" @default.
- W2002131468 title "<title>Process latitude for the chemical amplification resists AZ PF514 and AZ PN114</title>" @default.
- W2002131468 doi "https://doi.org/10.1117/12.46388" @default.
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