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- W2002476503 abstract "Through-wafer interconnect is one of the key technologies for fabricating next-generation compact 3D microelectronic devices. The microstructure and mechanical properties of high aspect ratio through-wafer electroplated copper interconnects are reported in this paper. Copper was deposited in very high aspect ratio (~15) and narrow DRIE etched through-vias (15 mum) in silicon substrate by electrodeposition. With the presence of nano-scale grains and higher density of nano-twins, the copper columns were found to have significant higher hardness and tensile strength than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The grain structure of electroplated copper was found out by atomic force microscope and transmission electron microscope. The induced strain, a result of mismatch in coefficient of thermal expansion, was studied by digital image speckle correlation analysis, when the copper interconnects were subjected to a temperature cycle from 25degC to 125degC." @default.
- W2002476503 created "2016-06-24" @default.
- W2002476503 creator A5002810677 @default.
- W2002476503 creator A5016268742 @default.
- W2002476503 creator A5050734814 @default.
- W2002476503 creator A5056855373 @default.
- W2002476503 creator A5061216998 @default.
- W2002476503 creator A5066912549 @default.
- W2002476503 creator A5068031255 @default.
- W2002476503 date "2007-05-01" @default.
- W2002476503 modified "2023-09-23" @default.
- W2002476503 title "Characterization of Nano-grained High Aspect Ratio Through-wafer Copper Interconnect Column" @default.
- W2002476503 cites W1965807739 @default.
- W2002476503 cites W2017728171 @default.
- W2002476503 cites W2026635780 @default.
- W2002476503 cites W2040028885 @default.
- W2002476503 cites W2068362851 @default.
- W2002476503 cites W2072383742 @default.
- W2002476503 cites W2101803823 @default.
- W2002476503 cites W2107398534 @default.
- W2002476503 cites W2120568838 @default.
- W2002476503 cites W2140513378 @default.
- W2002476503 cites W2154602891 @default.
- W2002476503 cites W2169714075 @default.
- W2002476503 doi "https://doi.org/10.1109/ectc.2007.374078" @default.
- W2002476503 hasPublicationYear "2007" @default.
- W2002476503 type Work @default.
- W2002476503 sameAs 2002476503 @default.
- W2002476503 citedByCount "3" @default.
- W2002476503 countsByYear W20024765032012 @default.
- W2002476503 countsByYear W20024765032013 @default.
- W2002476503 crossrefType "proceedings-article" @default.
- W2002476503 hasAuthorship W2002476503A5002810677 @default.
- W2002476503 hasAuthorship W2002476503A5016268742 @default.
- W2002476503 hasAuthorship W2002476503A5050734814 @default.
- W2002476503 hasAuthorship W2002476503A5056855373 @default.
- W2002476503 hasAuthorship W2002476503A5061216998 @default.
- W2002476503 hasAuthorship W2002476503A5066912549 @default.
- W2002476503 hasAuthorship W2002476503A5068031255 @default.
- W2002476503 hasConcept C116372231 @default.
- W2002476503 hasConcept C159985019 @default.
- W2002476503 hasConcept C160671074 @default.
- W2002476503 hasConcept C187937830 @default.
- W2002476503 hasConcept C191897082 @default.
- W2002476503 hasConcept C192562407 @default.
- W2002476503 hasConcept C2779227376 @default.
- W2002476503 hasConcept C49040817 @default.
- W2002476503 hasConcept C51807945 @default.
- W2002476503 hasConcept C544778455 @default.
- W2002476503 hasConcept C544956773 @default.
- W2002476503 hasConcept C87976508 @default.
- W2002476503 hasConceptScore W2002476503C116372231 @default.
- W2002476503 hasConceptScore W2002476503C159985019 @default.
- W2002476503 hasConceptScore W2002476503C160671074 @default.
- W2002476503 hasConceptScore W2002476503C187937830 @default.
- W2002476503 hasConceptScore W2002476503C191897082 @default.
- W2002476503 hasConceptScore W2002476503C192562407 @default.
- W2002476503 hasConceptScore W2002476503C2779227376 @default.
- W2002476503 hasConceptScore W2002476503C49040817 @default.
- W2002476503 hasConceptScore W2002476503C51807945 @default.
- W2002476503 hasConceptScore W2002476503C544778455 @default.
- W2002476503 hasConceptScore W2002476503C544956773 @default.
- W2002476503 hasConceptScore W2002476503C87976508 @default.
- W2002476503 hasLocation W20024765031 @default.
- W2002476503 hasOpenAccess W2002476503 @default.
- W2002476503 hasPrimaryLocation W20024765031 @default.
- W2002476503 hasRelatedWork W1495478866 @default.
- W2002476503 hasRelatedWork W1972820050 @default.
- W2002476503 hasRelatedWork W2022728903 @default.
- W2002476503 hasRelatedWork W2041579336 @default.
- W2002476503 hasRelatedWork W2258436323 @default.
- W2002476503 hasRelatedWork W2304908975 @default.
- W2002476503 hasRelatedWork W2357275884 @default.
- W2002476503 hasRelatedWork W2519393962 @default.
- W2002476503 hasRelatedWork W2776341574 @default.
- W2002476503 hasRelatedWork W3101851581 @default.
- W2002476503 isParatext "false" @default.
- W2002476503 isRetracted "false" @default.
- W2002476503 magId "2002476503" @default.
- W2002476503 workType "article" @default.