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- W2002574525 abstract "High power diode laser beam combining using micro-optics components is emerging as a cost-effective technique forproducing high power laser output from small-sized laser packages. Packaging of micro-optics lenses and lens arraysthat are matched to lithographically fabricated diode laser waveguides provides a practical approach for combiningmultiple field distributions into a single high output power beam. Beam combining is often associated with additionaloutput beam shaping that is tailored to a specific photonics application which the laser is intended for, such as surfacetreatment or micro-fabrication, photomedicine, laser pumping, or remote spectroscopy.It is shown that packaging imperfections and components' misalignments during the packaging phase influence theoutput laser beam spatial characteristics and produce specific beam distortions. Micro-optics design optimized forpackaging and integration reduces the beam distortions caused by packaging imperfections, such as post-bondingshifts and lens-induced aberrations. Another role of optical design optimization and tolerance analysis is in providing adeterministic approach for distinguishing specific misalignment effects based on the observed distortions of the beamdistributions. This, in turn, is used to develop appropriate compensation techniques that can be applied to improve thequality of the combined beam output during the fabrication process." @default.
- W2002574525 created "2016-06-24" @default.
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- W2002574525 date "2011-02-10" @default.
- W2002574525 modified "2023-09-23" @default.
- W2002574525 title "Micro-optics packaging and integration for high-power diode laser beam combining" @default.
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- W2002574525 doi "https://doi.org/10.1117/12.874178" @default.
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