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- W2002806859 abstract "The paper presents a method of VLSI circuits testing using thermal phenomenon. The method is based on an original algorithm of placing temperature sensors on the chip surface and analysing temperature measurement results. The method enables both failure detection and location. Examples and results of analyses are presented." @default.
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- W2002806859 date "2001-11-01" @default.
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- W2002806859 title "A method of thermal testing of microsystems" @default.
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- W2002806859 doi "https://doi.org/10.1016/s0026-2714(01)00088-9" @default.
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