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- W2003059092 abstract "The rates of copper cementation on pure aluminum discs were studied as a function of (a) initial copper ion concentration, (b) temperature, (c) initial hydrogen ion concentration, and (d) the effect of the peripheral velocity of the Al disc.At low initial copper ion concentration (1 × 10−4M), there are two rate-controlling processes: ionic diffusion control at temperatures. above 40°C, and surface reaction control at temperatures below 40° C. At higher initial copper ion concentrations (5 × 10−3 M), the rate is controlled by a chemical (surface) reaction.When the-hydrogen ion concentration is increased to 0.7 M, the cementation rate increases. The pH remains constant during the reaction.The cemented deposit is pure copper. The structure. of the deposit is dependent on both temperature and the initial copper ion concentration. At high initial copper ion concentration (5 × 10-3 M) and at high temperatures (75° C), the rate, which was constant initially, increases with increasing deposition. Résumé Les taux de cémentation du cuivre sur des disques d'aluminium pur ont été étudié en fonction (a) de la concentration initiale des ions cuivres, (b) de la température, (c) de la concentration initiale des ions hydrogene et (d) de l'effet de la vitesse tangentielle du disque d'aluminium.Pour une faible concentration initiale d'ions cuivre (1 × 10−4 M) il y a deux processus régulateurs : à des températures supérieures à 40°C un côntrale de diffusion ionique et à moins de 40°C un côntrale de la réaction de surface. Pour des concentrations d'ions cuivre plus élevées (5 × 10−3 M), le taux est contrôlé par une réaction chimique (de surface).Quand la concentration des ions hydrogène est augmentée à 0.7M Ie taux de cémentation augmente, lp. pH demeure constant pendant la réaction.Le dépôt est du cuivre pur et sa structure dépend à la fois de la température et de la teneur initiale en ions cuivre. A haute concentration initiale d'ions cuivre (5 × 10-3M) et à haute temperature (75°C), le taux, constant du début, augmente quand le dépôt augmente." @default.
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- W2003059092 date "1970-07-01" @default.
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- W2003059092 title "Kinetics of Cu(II) cementation on a pure aluminum disc in acidic sulphate solutions" @default.
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- W2003059092 doi "https://doi.org/10.1179/cmq.1970.9.3.443" @default.
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