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- W2003539483 abstract "Three-dimensional (3D) integration with through-silicon via (TSV) is an emerging technology which has been expected to lead to an industry paradigm shift. Will the industry steam forward with the gusto of 3D IC with TSV? I consider its success in homogeneous integration by looking forward the solution to the following three awareness problems: variability, TSV, and thermal." @default.
- W2003539483 created "2016-06-24" @default.
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- W2003539483 date "2010-01-18" @default.
- W2003539483 modified "2023-09-23" @default.
- W2003539483 title "Homogeneous integration for 3D IC with TSV" @default.
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- W2003539483 doi "https://doi.org/10.5555/1899721.1899851" @default.
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