Matches in SemOpenAlex for { <https://semopenalex.org/work/W2003557910> ?p ?o ?g. }
Showing items 1 to 91 of
91
with 100 items per page.
- W2003557910 endingPage "871" @default.
- W2003557910 startingPage "865" @default.
- W2003557910 abstract "Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a 50μm of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality." @default.
- W2003557910 created "2016-06-24" @default.
- W2003557910 creator A5048465651 @default.
- W2003557910 creator A5056363248 @default.
- W2003557910 creator A5087926729 @default.
- W2003557910 date "2014-10-01" @default.
- W2003557910 modified "2023-09-25" @default.
- W2003557910 title "Micro-bump Joining Technology for 3 Dimensional Chip Stacking" @default.
- W2003557910 cites W1971996096 @default.
- W2003557910 cites W2001917473 @default.
- W2003557910 cites W2008609724 @default.
- W2003557910 cites W2040508543 @default.
- W2003557910 cites W2105877450 @default.
- W2003557910 cites W2119842981 @default.
- W2003557910 cites W2120669573 @default.
- W2003557910 cites W2138993883 @default.
- W2003557910 cites W2157762801 @default.
- W2003557910 cites W2171461606 @default.
- W2003557910 doi "https://doi.org/10.7736/kspe.2014.31.10.865" @default.
- W2003557910 hasPublicationYear "2014" @default.
- W2003557910 type Work @default.
- W2003557910 sameAs 2003557910 @default.
- W2003557910 citedByCount "1" @default.
- W2003557910 countsByYear W20035579102021 @default.
- W2003557910 crossrefType "journal-article" @default.
- W2003557910 hasAuthorship W2003557910A5048465651 @default.
- W2003557910 hasAuthorship W2003557910A5056363248 @default.
- W2003557910 hasAuthorship W2003557910A5087926729 @default.
- W2003557910 hasBestOaLocation W20035579102 @default.
- W2003557910 hasConcept C119599485 @default.
- W2003557910 hasConcept C121332964 @default.
- W2003557910 hasConcept C125619702 @default.
- W2003557910 hasConcept C127413603 @default.
- W2003557910 hasConcept C159985019 @default.
- W2003557910 hasConcept C160671074 @default.
- W2003557910 hasConcept C165005293 @default.
- W2003557910 hasConcept C174348530 @default.
- W2003557910 hasConcept C192562407 @default.
- W2003557910 hasConcept C2779227376 @default.
- W2003557910 hasConcept C31258907 @default.
- W2003557910 hasConcept C33347731 @default.
- W2003557910 hasConcept C41008148 @default.
- W2003557910 hasConcept C46141821 @default.
- W2003557910 hasConcept C49040817 @default.
- W2003557910 hasConcept C50296614 @default.
- W2003557910 hasConcept C530198007 @default.
- W2003557910 hasConcept C59088047 @default.
- W2003557910 hasConcept C68928338 @default.
- W2003557910 hasConcept C79072407 @default.
- W2003557910 hasConceptScore W2003557910C119599485 @default.
- W2003557910 hasConceptScore W2003557910C121332964 @default.
- W2003557910 hasConceptScore W2003557910C125619702 @default.
- W2003557910 hasConceptScore W2003557910C127413603 @default.
- W2003557910 hasConceptScore W2003557910C159985019 @default.
- W2003557910 hasConceptScore W2003557910C160671074 @default.
- W2003557910 hasConceptScore W2003557910C165005293 @default.
- W2003557910 hasConceptScore W2003557910C174348530 @default.
- W2003557910 hasConceptScore W2003557910C192562407 @default.
- W2003557910 hasConceptScore W2003557910C2779227376 @default.
- W2003557910 hasConceptScore W2003557910C31258907 @default.
- W2003557910 hasConceptScore W2003557910C33347731 @default.
- W2003557910 hasConceptScore W2003557910C41008148 @default.
- W2003557910 hasConceptScore W2003557910C46141821 @default.
- W2003557910 hasConceptScore W2003557910C49040817 @default.
- W2003557910 hasConceptScore W2003557910C50296614 @default.
- W2003557910 hasConceptScore W2003557910C530198007 @default.
- W2003557910 hasConceptScore W2003557910C59088047 @default.
- W2003557910 hasConceptScore W2003557910C68928338 @default.
- W2003557910 hasConceptScore W2003557910C79072407 @default.
- W2003557910 hasIssue "10" @default.
- W2003557910 hasLocation W20035579101 @default.
- W2003557910 hasLocation W20035579102 @default.
- W2003557910 hasOpenAccess W2003557910 @default.
- W2003557910 hasPrimaryLocation W20035579101 @default.
- W2003557910 hasRelatedWork W190883597 @default.
- W2003557910 hasRelatedWork W1977872418 @default.
- W2003557910 hasRelatedWork W1983340962 @default.
- W2003557910 hasRelatedWork W1996224802 @default.
- W2003557910 hasRelatedWork W2140000749 @default.
- W2003557910 hasRelatedWork W2141504104 @default.
- W2003557910 hasRelatedWork W2168917860 @default.
- W2003557910 hasRelatedWork W2328103676 @default.
- W2003557910 hasRelatedWork W1678089238 @default.
- W2003557910 hasRelatedWork W2037547845 @default.
- W2003557910 hasVolume "31" @default.
- W2003557910 isParatext "false" @default.
- W2003557910 isRetracted "false" @default.
- W2003557910 magId "2003557910" @default.
- W2003557910 workType "article" @default.