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- W2004524124 abstract "This paper describes the low-temperature bonding of a lithium niobate (LiNbO3) waveguide chip to a silicon (Si) substrate for integrated optical systems. The bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au thin films (thickness: 100 nm) of the LiNbO3 chip and the Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. The bonded chips fractured at bonding temperature higher than 150°C because of the coefficient of thermal expansion (CTE) mismatch. The LiNbO<sub>3 </sub>chips were successfully bonded to the Si substrates at relatively low temperature (100°C). The die-shear strength of the LiNbO<sub>3</sub> chip was estimated to be more than 12 kg (3.8 MPa), the upper limit of our shear testing equipment." @default.
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- W2004524124 date "2005-12-05" @default.
- W2004524124 modified "2023-10-03" @default.
- W2004524124 title "Low temperature bonding of LiNbO 3 waveguide chips to Si substrates in air" @default.
- W2004524124 doi "https://doi.org/10.1117/12.653072" @default.
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