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- W2005107923 abstract "Stacking faults and grain boundaries of Ti 3 SiC 2 have been investigated by means of high-resolution electron microscopy. The stacking faults were found to result from insertion of additional TiC layers, instead of dissociation of dislocations conventionally observed in other materials. The stacking faults with many TiC layers inserted can also be viewed as TiC platelets. A glass phase is not formed at large-angle grain boundaries of Ti 3 SiC 2, manifesting the weak directionality of bonding in Ti 3 SiC 2 . The results also indicate that the softening of Ti 3 SiC 2 at high temperatures does not result from intergranular glass films but from an intrinsic property of Ti 3 SiC 2 . Moreover, it was found that one grain contacts the other with its base plane for most of the investigated grain boundaries." @default.
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- W2005107923 date "2003-05-01" @default.
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- W2005107923 title "Stacking faults and grain boundaries of Ti 3 SiC 2" @default.
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- W2005107923 doi "https://doi.org/10.1080/0950083031000104367" @default.
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