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- W2005263239 abstract "Low resistance ohmic contacts were fabricated on diamond films. A high boron concentration (~10 20 cm -3 ) was obtained on the surface by ion implantation. The initial film of Ti (20nm) followed by Au (100nm) was deposited by r. f. sputtering. I-V measurements showed that the as-deposited contacts were ohmic. Upon annealing, the ohmic characteristics of the contacts were improved significantly. The specific contacts resistivity decreased from 6.2 × 10 -3 to 1.2 × 10 -6 Ω cm 2 as a result of post-deposition annealing. The X-ray photoelectron spectroscopy analysis indicated the formation of titanium carbide at the Ti/diamond interface in the as-deposited and annealed states. A low oxygen concentration was observed." @default.
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- W2005263239 date "2002-03-20" @default.
- W2005263239 modified "2023-09-22" @default.
- W2005263239 title "OHMIC CONTACTS ON DIAMOND BY R. F. SPUTTERING AND Ti-Au METALLIZATION" @default.
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- W2005263239 doi "https://doi.org/10.1142/s0217979202010634" @default.
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