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- W2005272246 abstract "A novel terpolymer of a methylated phenol, p-trimethylsilylmethyl phenol and formaldehyde was synthesized. With a 9.7wt% Si content, the polymer displayed an RIE resistance 10 times greater than hard-baked HPR 204. The organosilicon novolac was employed as a base resin component of bilevel resist systems for both photo and electron-beam lithography. The low molecular weight polymer behaves as a positive resist when mixed with a dissolution inhibitor. In photo-lithography, the dissolution inhibitor was a diazoquinone based chemical which was converted to an acidic species during irradiation. In electron-beam lithography, poly (2-methyl-l-pentene sulfone) (PMPS), which depolymerizes upon electron-irradiation, functioned as the dissolution inhibitor. When the silylated novolac was used as a photoresist, coded 0.8μm line/space patterns were obtained with a sensitivity of -120 mJ/cm<sup>2</sup>. When employed as,an electron-beam resist coded 0.75μm line/space patterns were resolved with a dose of 8μC/cm<sup>4</sup>." @default.
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- W2005272246 date "1986-07-09" @default.
- W2005272246 modified "2023-09-23" @default.
- W2005272246 title "Synthesis And Lithographic Characterization Of A Novel Organosilicon Novolac Resin" @default.
- W2005272246 doi "https://doi.org/10.1117/12.963624" @default.
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