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- W2005403816 abstract "This paper focuses on electromigration of SnAgCu interconnects of Fanout embedded Wafer Level Ball Grid Array (FO-eWLB) technology. Black's parameters are analyzed regarding stage of degradation through approaches based on resistance slope modeling and on Failure Criterion (FC)." @default.
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- W2005403816 date "2012-04-01" @default.
- W2005403816 modified "2023-10-13" @default.
- W2005403816 title "Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package" @default.
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- W2005403816 doi "https://doi.org/10.1109/irps.2012.6241792" @default.
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