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- W2006262037 abstract "The relation between electron beam sensitivity and resolution of chlorinated polymethylstyrene with respect to molecular weight, electron acceleration voltage, prebaking temperature, and dry etching resistance were investigated. The chlorinated polymethylstyrene shows high sensitivity, 0.4 μC/cm2, to electron beam exposure and good resistance to dry etching under the aluminum etching conditions. The residual film thickness of chlorinated polymethylstyrene after electron beam exposure changed in vacuum due to the postpolymerization effect, but this change was less pronounced than that of the negative electron beam resist, poly(glycidyl methacrylate)." @default.
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- W2006262037 date "1986-06-01" @default.
- W2006262037 modified "2023-09-22" @default.
- W2006262037 title "High Sensitivity, Dry‐Etch‐Resistant Negative EB Resist" @default.
- W2006262037 doi "https://doi.org/10.1149/1.2108825" @default.
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