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- W2006271449 abstract "In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz." @default.
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- W2006271449 date "2012-12-01" @default.
- W2006271449 modified "2023-10-01" @default.
- W2006271449 title "Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes" @default.
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- W2006271449 doi "https://doi.org/10.1109/lmwc.2012.2227141" @default.
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