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- W2006377075 abstract "Laser micro-welding of electronic components using the wavelength l= 1064 nm is state-of-the-arttechnology. However, in these parts some metals that needs to be welded, especially copper and gold,show high reflection and hence low absorption rates of under 4 % for the infrared wavelength range.Further, for increasing temperatures above the melting point of these metals, the absorption rate riseserratically. Since the fusion time point is dependent on different factors, it cannot be calculated preciselybeforehand. This makes process control difficult and decreases the required process window for lasermicro-welding of these materials.On the other hand, these metals show a ten-times higher absorption rate for the wavelength l = 532 nm,meaning the use of a frequency-converted Nd:YAG laser becomes interesting for micro-welding. In thispaper, investigations on laser micro-welding using a frequency-converted laser at the wavelength of l =532 nm were carried out. In order to evaluate the laser process, on a demonstrator board electricalcomponents (TSSOP) with a pitch of 0.5 mm were welded directly onto the copper strip conductors withheights of d = 70 μm.The laser welding process with l = 532 nm delivered constant results. Within the characterization by ashear tester an average shear force of F = 5.5 N per lead could be realized." @default.
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- W2006377075 date "2007-02-08" @default.
- W2006377075 modified "2023-09-23" @default.
- W2006377075 title "Micro welding of electronic components with 532nm laser radiation" @default.
- W2006377075 doi "https://doi.org/10.1117/12.705385" @default.
- W2006377075 hasPublicationYear "2007" @default.
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