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- W2006672299 abstract "Some 3D interconnects technologies are reviewed and discussed in this paper with respect to emerging 3D applications. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, the very fine pitch below 10μm will be mandatory for 3DIC and many options like cu-cu bonding or μ-tubes are in the race. Specific interconnects for RF/mm-waves and low volume electronics devices are also discussed with relevant examples." @default.
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- W2006672299 date "2013-10-01" @default.
- W2006672299 modified "2023-09-24" @default.
- W2006672299 title "Which interconnects for which 3D applications? Status and perspectives" @default.
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- W2006672299 doi "https://doi.org/10.1109/3dic.2013.6702344" @default.
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