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• W2006794001 abstract "The constitutive behaviour of Sn96.5Ag3.5, Sn95.5Ag4Cu0.5 and Sn63Pb37 solder was investigated on ultra small flip chip solder joints (V=1×10−12 m3). In order to run experiments on these small specimens, a micro shear tester has been designed. The tester is optimised to achieve high precision. It is able to record force displacement hysteresis with a resolution of better than 1 mN and 20 nm for force and displacement measurements, respectively. It was found that the creep behaviour of the lead-free solders exhibit a very high dependence on stress (Sn96.5Ag3.5: n=11; Sn95.5Ag4Cu0.5: n=18), while the eutectic SnPb showed a low stress dependence of n=2." @default.
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• W2006794001 date "2002-04-01" @default.
• W2006794001 modified "2023-10-16" @default.
• W2006794001 title "Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints" @default.
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• W2006794001 doi "https://doi.org/10.1016/s0924-4247(01)00880-9" @default.
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