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- W2007079944 abstract "The breakdown voltage of a lead borosilicate glass used to passivate ‘mesa’-channels in silicon chips is considerably lowered by the chemical treatments required by the fabrication flow chart. Surface analysis and near-surface analysis of the glass samples shows that the chemical etching depletes both surface and near-surface regions of the glass of Al, B and Pb. Contemporaneously the glass surface becomes O- and H-rich with respect to the untreated samples. This is consistent with a mechanism based upon the formation of a silanol-rich surface which lowers the breakdown voltage." @default.
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- W2007079944 date "1987-09-01" @default.
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- W2007079944 title "Breakdown voltage and surface compositon in a lead borosilicate glass" @default.
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- W2007079944 doi "https://doi.org/10.1002/sia.740100703" @default.
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