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• W2007218761 abstract "Abstract The silicon vertical hall devices are fabricated using a modified bipolar process. It consists of the thin p-layer at Si-SiO 2 ¸ interface andn-epi layer without n + buried layer to improve the sensitivity and influence of interface effects. Experimental samples are a sensor type Iwith and type H without p + isolation dam adjacent to the center current electrode. The experimental results for both type show a more highcurrent-related sensitivity than the former's vertical hall devices. The sensitivity of type H and type I are about 150 V/AT and 340 V/AT,respectively. This sensor's behavior can be explained by the similar J-FET model. Keywords : Vertical Hall Device, n + buried Layer, Thin p-layer, p + Isolation Dam 
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• W2007218761 date "2011-07-31" @default.
• W2007218761 modified "2023-09-26" @default.
• W2007218761 title "Magnetic Sensitivity Improvement of Silicon Vertical Hall Device" @default.
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• W2007218761 doi "https://doi.org/10.5369/jsst.2011.20.4.260" @default.
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