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- W2007225944 abstract "Silicon nitride ceramics were prepared from a high‐purity silicon powder doped with 2 mol% Y 2 O 3 and 5 mol% M g O as sintering additives via a route of sintering of reaction‐bonded silicon nitride ( SRBSN ). The materials sintered at 1900°C for 3, 6, 12, and 24 h had thermal conductivities of 109, 125, 146, and 154 W/m/K, and four‐point bending strengths of 786, 676, 608, and 505 MP a, respectively. The fracture toughness values, determined by the single‐edge‐precracked‐beam ( SEPB ) method, were 8.4, 8.6, 9.7, and 10.7 MP a m 1/2 for the materials sintered for 3, 6, 12, and 24 h, respectively, which were similar to the results measured by the chevron‐notched‐beam ( CNB ) test method. The materials sintered for longer times (12 and 24 h) showed stronger R ‐curve behaviors over longer range of crack extension, in comparison with the materials sintered for shorter times (3 and 6 h)." @default.
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- W2007225944 date "2013-05-03" @default.
- W2007225944 modified "2023-10-18" @default.
- W2007225944 title "Fracture Resistance Behavior of High-Thermal-Conductivity Silicon Nitride Ceramics" @default.
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- W2007225944 doi "https://doi.org/10.1111/ijac.12109" @default.
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