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- W2007455807 abstract "This paper describes the effect of ground vias on signal integrity when a signal changes layers and passes through multiple ground planes in a printed circuit board. An equivalent circuit is given that models the return current path when a signal passes through multiple ground planes that are not connected nearby the signal via. The effect is seen as a region of higher impedance than expected on the destination signal layer. Time-domain reflectometry measurements are taken on an actual printed circuit board that exhibits this behavior. The empirical measurements are compared to SPICE simulations of the equivalent circuit to verify the accuracy of the model. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 28: 257–260, 2001." @default.
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- W2007455807 title "The effect of ground vias on changing signal layers in a multilayered PCB" @default.
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- W2007455807 doi "https://doi.org/10.1002/1098-2760(20010220)28:4<257::aid-mop1011>3.0.co;2-l" @default.
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