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- W2007664149 abstract "The silsesquioxane (SSQ) films with low dielectric constant have been successfully synthesized by covalently binding a thermally decomposable porogen [poly(amidoamine), PAMAM] to a host polymer (hydrogen methyl silsesquioxane, HMSQ) via a coupling agent. The decomposition behavior of the porogen as well as the thermal and dielectric properties of the host polymer heat-treated in different atmospheres have been studied and compared. The dielectric properties of the HMSQ–PAMAM porous films have been investigated as a function of porogen concentration. An average dielectric constant about 2.06 could be obtained with leakage current density on the order of 10-7 A/cm2 for a film with 20-wt.% loading of the PAMAM polymer." @default.
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- W2007664149 date "2005-02-01" @default.
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- W2007664149 title "Synthesis and characterization of porous silsesquioxane dielectric films" @default.
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- W2007664149 doi "https://doi.org/10.1016/j.tsf.2004.03.040" @default.
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