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• W2007885511 abstract "Rare-earth-containing Pb-free solders have gained widespread attention due to their superior ductility relative to conventional Pb-free alloys. Our previous work has shown that new Ce-based alloys are also extremely oxidation resistant compared to La or Y-containing alloys. In this paper, we report on a mechanism-based model for the large increases in ductility with small addition of rare-earth element to Sn–3.9Ag–0.7Cu. The mechanisms of ductility enhancement by Ce were observed in a scanning electron microscope, in interrupted shear-tests, where CeSn3 particles served as microscopic fracture and void nucleation sites. Micro-mechanical modeling using the finite-element method was used to examine the plastic strain field in solder affected by the particles. The concentrated deformation band was seen to be disturbed by the particles, resulting in a more uniform deformation pattern with reduced strains and thus enhanced ductility of the lap-sheared joint." @default.
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• W2007885511 date "2011-06-01" @default.
• W2007885511 modified "2023-09-23" @default.
• W2007885511 title "Mechanisms of deformation in high-ductility Ce-containing Sn–Ag–Cu solder alloys" @default.
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• W2007885511 doi "https://doi.org/10.1016/j.microrel.2011.02.005" @default.
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