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- W2008008867 abstract "The room-temperature microstructural evolution of 18 μm thick electroplated copper deposits was investigated by cross-sectional focused ion-beam microscopy. The fraction of transformed volume as a function of annealing time was measured. The transformation was found to start and nucleate from the bottom of the foils and then propagate towards the free surfaces. Based on differential scanning calorimetry results, the activation energy for grain growth is 0.85 eV atom−1. The mechanism of the grain growth is also discussed." @default.
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- W2008008867 date "2008-01-01" @default.
- W2008008867 modified "2023-10-16" @default.
- W2008008867 title "The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils" @default.
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- W2008008867 doi "https://doi.org/10.1016/j.scriptamat.2007.08.028" @default.
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