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• W2008082809 abstract "We present experiments with Bose-Einstein condensates on a combined atom chip. The combined structure consists of a large-scale ``carrier chip'' and smaller ``atom-optics chips,'' containing micron-sized elements. This allows us to work with condensates very close to chip surfaces without suffering from fragmentation or losses due to thermally driven spin flips. Precise three-dimensional positioning and transport with constant trap frequencies are described. Bose-Einstein condensates were manipulated with submicron accuracy above atom-optics chips. As an application of atom chips, a direction sensitive magnetic-field microscope is demonstrated." @default.
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• W2008082809 date "2005-06-30" @default.
• W2008082809 modified "2023-09-23" @default.
• W2008082809 title "Combined chips for atom optics" @default.
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• W2008082809 doi "https://doi.org/10.1103/physreva.71.063619" @default.
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