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- W2008704273 abstract "We report here the successful use of poly(2‐vinylpyridine) as an adhesion promoter for use with poly(methylmethacrylate) (PMMA) resist on . The material maintains resist integrity during normal wet chemical etching and cleaning procedures and has been used to fabricate 0.5 μm recessed gate MESFET devices using both E‐beam direct write and deep UV contact lithography. It is spin‐coated prior to the application of the PMMA, which is then processed in the conventional manner. We have extended the investigation to include a preliminary evaluation of copolymers of 2‐vinylpyridine and methylmethacrylate as deep UV resists." @default.
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- W2008704273 date "1986-03-01" @default.
- W2008704273 modified "2023-09-24" @default.
- W2008704273 title "GaAs Process Compatible Adhesion Promoter for PMMA Resists" @default.
- W2008704273 doi "https://doi.org/10.1149/1.2108630" @default.
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