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- W2008972503 abstract "SiCN film is widely used in modern integrated circuit fabrication industry as etch stop layer and copper block layer. But the interface quality of SiCN/Cu is usually not good enough, which will lead to VBD test fail. In this paper we reported that the top metal stress have a strong side effect on inter metal, especially the layer right under top metal, VBD performance. By increase top via depth or by introduce ultra violet light cure of top SiCN film, we can obviously improve inter metal VBD performance. We also put forward a mechanism to explain all these phenomena." @default.
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- W2008972503 date "2014-02-27" @default.
- W2008972503 modified "2023-09-27" @default.
- W2008972503 title "The Influence of Top Metal (TM) Layer Stress on Underneath Inter-Metal VBD Performance" @default.
- W2008972503 doi "https://doi.org/10.1149/06001.0039ecst" @default.
- W2008972503 hasPublicationYear "2014" @default.
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