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- W2009524712 abstract "The manufacturing process of printed circuit board (PCB) for the Rambus™-in-line memory module (RIMM™) is presented in this study. Emphasis is placed on the key process steps and the important parameters of each step. Cross sections of the PCB are examined for a better understanding of the 8-layer structure. Electrical performances such as the controlled impedance, propagation delay, crosstalk, and attenuation of the PCB are measured by the time domain reflectometer (TDR). The results are compared against the specifications." @default.
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- W2009524712 date "1999-09-01" @default.
- W2009524712 modified "2023-09-27" @default.
- W2009524712 title "PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM™" @default.
- W2009524712 doi "https://doi.org/10.1142/s0960313199000131" @default.
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