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- W2009703404 abstract "The goal of the course is to give you a brief overview of MEMS technologies by covering packaging, reliability, simulation, and testing. We will venture into recent developments like Sensor Fusion, Integrated CMOS-MEMS, and BioMEMS. You will gain an in-depth knowledge of challenges and opportunities associated with bringing MEMS-based products to market through the course's focus on two key topics: (1) MEMS Packaging - You will learn packaging concepts for MEMS devices while reviewing assembly and packaging procedures such as structural release, cleaning, encapsulation, and testing. The tutorial will also cover various challenges associated with packaging and testing MEMS. (2) MEMS Reliability - This tutorial will review MEMS reliability issues and associated analysis/simulation techniques. MEMS reliability requires a broad understanding of physics, material science, and mechanics in order to handle the challenges during research, development, and productization." @default.
- W2009703404 created "2016-06-24" @default.
- W2009703404 creator A5074912205 @default.
- W2009703404 date "2013-04-01" @default.
- W2009703404 modified "2023-09-24" @default.
- W2009703404 title "Invited tutorial: MEMS: Driving advances in electronic devices" @default.
- W2009703404 doi "https://doi.org/10.1109/wmed.2013.6544496" @default.
- W2009703404 hasPublicationYear "2013" @default.
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