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• W2009780862 abstract "The interfacial adhesion of polyethylene (PE) and polyamide 6 (PA6) was enhanced via reactive compatibilization in a sequential injection molding process through PE+PE-MAH/PA6 bilayer system and PE/tie layer/PA6 sandwich system in this article. The experimental results showed that the crack propagation for sandwich system changed from the adhesive interface to a thin layer in the bulk of PE with increasing molding temperature. More copolymers were in-situ formed at sandwich interface. Therefore, stronger interfacial adhesion of PE/PA6 obtained in sandwich system was presumably attributed to higher interfacial temperature formed at sandwich interface during sequential injection molding process." @default.
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• W2009780862 date "2014-01-02" @default.
• W2009780862 modified "2023-09-24" @default.
• W2009780862 title "Comparative Studies on Enhanced Interfacial Adhesion between PE and PA6 through Two Routes in a Sequential Injection Molding Process" @default.
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• W2009780862 doi "https://doi.org/10.1080/03602559.2013.836536" @default.
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