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- W2010102823 abstract "The implementation of fluidic functions in 3D-MID (three dimensional molded interconnect devices) allows to create a new field of applications and enhanced system solutions. We report about the capabilities of MID for the packaging of chip modules with microfluidic functions. A mechanically stable and leak tight fluidic connection is needed between the microfluidic chip and the environment. For this purpose a fluidic interposer is fabricated by the LDS-process (laser direct structuring) and includes a metallization for electrical signals and channel structures for fluidic features. The presented interposer enables the transformation of fluidic ports from the macro- to the micro scale. To characterize the device, a microfluidic test chip made of silicon and glass (Borofloat®) has been fabricated and mounted on the fluidic interposer by a flip-chip vapor phase process. Finally the potential of the system is shown by testing maximum pressurization and fluidic sealing." @default.
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- W2010102823 date "2012-09-01" @default.
- W2010102823 modified "2023-09-25" @default.
- W2010102823 title "A novel injection molded fluidic interposer for microfluidic applications" @default.
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- W2010102823 doi "https://doi.org/10.1109/estc.2012.6542059" @default.
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