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• W2010147117 abstract "This paper reports on a bulk-micromachined silicon uncooled thermal imager intended for use in automated semiconductor process control. The device has a responsivity of 15 V/W, a thermal time constant of 1 ms, and a D* of 1.6×107 cm Hz1/2/W. It is organized as a 32×32-element area array with on-chip address generation, multiplexing, and self-test circuitry. The overall chip size is 16 mm×16 mm, with a 12 mm×12 mm imaging area. Each detector consists of 32 n–p polysilicon thermocouples supported on a dielectric window and is micromachined using a novel combined front-undercut and back-etched process. An infrared camera system using the imager is also described." @default.
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• W2010147117 title "A 1024-element bulk-micromachined thermopile infrared imaging array" @default.
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• W2010147117 doi "https://doi.org/10.1016/s0924-4247(98)00276-3" @default.
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