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- W2010478794 abstract "A deoxidized low-phosphorous copper processed by eight cycles of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to . The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to , however above they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The hardness of the copper decreased slightly with the annealing temperature up to , however they dropped largely above . Annealing characteristics of the copper were compared with those of an oxygen free copper processed by ARB and subsequently annealed." @default.
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- W2010478794 date "2007-07-01" @default.
- W2010478794 modified "2023-10-18" @default.
- W2010478794 title "Line Length Effect on Electromigration Characteristics of Eutectic SnPb Solder" @default.
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- W2010478794 doi "https://doi.org/10.3740/mrsk.2007.17.7.361" @default.
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