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- W2010670050 abstract "Electroplated copper bumps expected as fine metallic bumps for electronic packaging were investigated experimentally considering the change of micro texture dependence of their electroplating conditions and heat treatment after the electroplating. Not only Young’s modulus but also the strength of electroplated copper thin films changed drastically depending on the change of their micro texture, and these values were significantly different from conventional bulk copper. In addition, the strong anisotropy of Young’s modulus was observed between that along their thickness direction, and that parallel to their plane direction." @default.
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- W2010670050 date "2012-11-09" @default.
- W2010670050 modified "2023-09-26" @default.
- W2010670050 title "Micro-Texture Dependence of the Strength of Fine Metallic Bumps Used for Electronic Packaging" @default.
- W2010670050 doi "https://doi.org/10.1115/imece2012-87342" @default.
- W2010670050 hasPublicationYear "2012" @default.
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