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- W2011120166 abstract "Photosensitive polyimide (PSPI) is being integrated as potential low dielectric constant layers in next generation advanced silver metallization. These dielectrics have excellent thermal stability as represented by a thermal decomposition temperature of 450 °C and an average thermal expansion coefficient of 20×10−6/°C. This results in a low stress (<26 MPa) in the polyimide film as measured during in situ curing and cooling cycles. The morphology and structure of two types of polyimides, 3,3′,4,4′-biphenyl tetracarboxylic acid dianhydride-p-phenylenediamine (BPDA/PPD) and the PSPI based on BPDA/PPD, have been investigated in this work. Both refractive indices measurements and x-ray scans indicated that the 85 °C dried BPDA/PPD is slightly anisotropic, but the dried PSPI films are isotropic. Both polyimide films cured at 300 °C exhibit optical anisotropy with the average in-plane refractive index of 1.74 and the out-of-plane index of 1.62, indicating a strong preference of polymer chains to orient along the film plane. The dielectric constants were 3.0 and 2.6 in the in-plane and out-of-plane directions, respectively. The reduced number of process steps associated with PSPI and Ag etch over conventional Cu chemical mechanical polishing, shows great potential in terms of future process integration." @default.
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- W2011120166 date "2001-07-01" @default.
- W2011120166 modified "2023-09-26" @default.
- W2011120166 title "Characterization of thin photosensitive polyimide films for future metallization schemes" @default.
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- W2011120166 doi "https://doi.org/10.1116/1.1379797" @default.
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